Compared with cob leds with golden wire, what is the advtange of wireless flip chip cob leds?
As the maturity of formal LED products is getting higher and higher, and the difficulty of technological upgrading becomes more and more difficult, flip-chip LED technology has gradually been sought after by the industry in recent years. Because it has no gold wire and good heat dissipation, but the cost is high, COB has become the best stepping stone to flip-chip to the market.
1. The bottom sapphire substrate, with it facing upwards, the photons are led out from the high-transmittance sapphire substrate, and the corresponding photons on the front-mounted chip need to pass through the ITO conductive layer.
2. Since the electrode faces down, the quantum well that emits heat is also underneath, so that the distance of heat conduction is the shortest and the heat dissipation effect is better.
3. The connection between the chip pad and the substrate is directly made of metal welding, which not only fixes the chip, but also enhances the heat conductivity (the thermal conductivity of pure metal is higher than that of non-metal).
4. Wire bonding is the most problem-prone process in LED packaging. More than 90% of LED dead lights are related to wire bonding. The use of flip-chip technology and non-gold-wire packaged LED light sources can completely solve the problem of dead lights. This is in COB. And the integrated light source is even more important.
5. The test temperature of the whole lamp is lower and the light decay is smaller.
